Scientists develop ice cream filling skeleton with enhanced thermal conductivity


Scientists develop ice cream filling skeleton with enhanced thermal conductivity

Production and characterization of 3-D BN-SiC skeletons. Credit: Dr. YAO Yimin

The research team, led by Dr. Sun Rong and Dr. Zeng Xiaoliang of the Shenzhen Institute of Advanced Technology (SIAT) at the Chinese Academy of Sciences, in collaboration with Professor Xu Jianbin from the University of Hong Kong, China, developed a novel lightweight, mechanically tough material. There was and could quickly transfer heat.


According to published research, ACS Applied Materials and Interfaces, A 3-way skeleton was obtained by drying-casting ice cream ice cream.

The high density of electricity is a growing challenge for heat dissipation. High content of filler may increase thermal conductivity, but inevitably lead to high cost and deterioration of mechanical properties. Thus, it is still a challenge to achieve thermal conductivity with reasonable mechanical properties.

Researchers have developed a new approach to the construction of interconnected and compatible Boron Nitride (BN) -silicon carbide (SiC) hybrid skeletons by ice compression and high temperature synthesis, and then prepare 3-D BN-SiC / polydimethylsiloxane compositions.

Ice sheets and synthesized BN-SiC skeletons have been shown to be effective fillers for enhancing the performance of thermal conductor materials in thermal interfaces.

The welding of SiC nanowires transformed the solid BN Sponge 3-D continuous skeleton through the phases of thin interface borosilicate glasses, which enhanced the transfer of phonons between adjacent BN plates and reduced intercellular phonon scattering.

“The merger process has further facilitated interfacial thermal transport. "Along with ice assembly technology, we offer an effective strategy to improve heat dissipation capabilities in electronics."

This study represents a new avenue for addressing the heat challenges of traditional electronic products.


The interface between room and temperature improves the cooling of gallium nitride devices


More info:
Yimin Yao et al. Significant enhancement of thermal conductivity by using ice-based and synthetic BN-SiC skeleton, ACS Applied Materials and Interfaces (2019). DOI: 10.1021 / acsami.9b19280

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Chinese Academy of Sciences

Quote:
Scientists have developed an ice-filled skeleton with enhanced thermal conductivity (March 20, 2020)
Read 24 March 2020
https://phys.org/news/2020-03-sledgeists-ice-templated-filler-skeleton-thermal.html

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